Reducing Cost of Space Photovoltaics via Sound-Assisted Substrate Reuse

High substrate costs limit the proliferation of many next-generation semiconductor device applications, such as high-efficiency GaAs-based photovoltaics for space applications, often consuming 50% of the cell manufacturing cost. We propose a novel substrate re-use technology, known as Sonic Lift-off (SLO) to drive down the costs of space photovoltaic manufacturing. SLO utilizes sound to separate thin devices from their host substrate, leaving the remaining substrate available for multiple reuses. A key milestone in the march towards commercialization is the ability to demonstrate the technology at industrially relevant wafer diameters. In this proposal we plan to build upon our successes to date demonstrating 2" diameter wafer SLO and extend this to 4" wafer diameters with improvements to our SLO instrumentation and process control.