SBIR/STTR Research Award
Versatile NanoCopper-Based TIM exceeding 50% Bulk Metal Performance
Award amount
$749,992Program and phase
SBIR · Phase IIAward year
2022Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- Kuprion, Inc.
- Proposal award date
- 2022-09-19
- Contract end date
- 2024-12-23
- UEI
- RNBFNG4LXHB8
- Solicitation number
- 19.2
- Topic code
- AF192-033
Research abstract
In Phase I, we demonstrated a high-conductance thermal interface materials (TIM) system for use in high power density applications that by far exceeded the project goal of 1340 W/cm2·K. We accomplished this goal using Kuprion’s patented ActiveCopper mater
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Highly Sorptive, Non-Shedding Dry Wipe for Very Rapid CWA Decomposition
- High Thermal Conductivity, Pitch-Based Carbon Fiber/Copper Composites
- Broadband Protection Against Known and Novel Infectious Pathogens Through Improved Filtration Systems
- High Thermal Conductivity, Multi-Layer, AlN-Based PCB Enabling Rapid Prototyping with Embedded Printed Components
- Power Electronics Thermal Interfaces (PETI)
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
Research funding history
9 SBIR/STTR records share this UEI (2019–2023). Reported award amounts total $3,473,624. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy