Versatile NanoCopper-Based TIM exceeding 50% Bulk Metal Performance

Kuprion and Lockheed Martin Corp. joined forces to propose the use of a novel nanocopper materials technology that allows the use of copper as a versatile and effective thermal interface material. Kuprion’s nanocopper converts to bulk copper at temperatures 195-240℃ in 5-8 min using standard solder reflow equipment under benign nitrogen environment, preventing oxidation during fusion. No pressure required. It has demonstrated drop-in replacement for solder. Thermal interface layers as thin as 2 micron have been achieved already via hand assembly of LED systems and have 20-25% improvement of Rth compared to AuSn solder. Bulk measurements revealed an intrinsic thermal conductivity of 277 W/m*K. Coupled with RMS expertise in die attachment techniques and companion electronics, this system provides an ideal solution for realizing high performance TIM for power electronics. The material is readily dispensable and stencil printable for die bonding and PCB assembly. The small amounts of additives and surfactants completely evaporate during fusion, eliminating any post cleaning requirements. It lacks a liquid transition state, which eliminates wicking during processing allowing for very close spacing of components/leads / contacts. The formulation will be modified to reduce CTE to increase stability to thermal cycling for maximize life under harsh operating conditions.