SBIR/STTR Research Award

Silicon Carbide High Temperature Solid State Memory

Award identifier 364b039e11e1f2705fa7a7641f5d1e490f8aa937fc4306300e446aed0d9cdb56Awarding agency National Aeronautics and Space Administration

Award amount

$149,999

Program and phase

SBIR · Phase I

Award year

2022

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
COOLCAD ELECTRONICS, INC.
Proposal award date
2022-07-14
Contract end date
2023-01-25
UEI
FJELK5N54RS3
Solicitation number
SBIR_22_P1
Topic code
S13

Research abstract

nbsp;The proposed work covers an initial feasibility analysis of high temperature tolerant memory cells. Additionally, the proposed work covers an exploratory set of small-scale experiments and a proof-of-concept demonstration. The project targets a well-rounded approach of ldquo;design for manufacturingrdquo; and ldquo;design for reliabilityrdquo; for temperature hardened memory electronics.A high temperature tolerant memory technology is needed for sensing and logging operations in harsh environments. To this end, silicon carbide offers a mature semiconductor technology that is akin to silicon in many aspects of its processing.A dynamic random-access memory (DRAM) is a crucial part of many silicon electronics. It provides a fast high-capacity storage solution in many applications due to its relatively small cell structure. The most compact DRAM array is based on one capacitor one transistor (1C1T) memory cell.nbsp;Even though the 1C1T memory cell is volatile in silicon due to the relatively high leakage currents at its p-n junctions, it is speculated that such a cell would be ldquo;practicallyrdquo; non-volatile and static if fabricated in silicon carbide. This is due to the fact that the reverse biased leakage currents in SiC p-n junctions is minimal, drastically cutting the loss rate of the stored charge, or increasing the time constant of the charge storage system.nbsp;nbsp;nbsp;The longest possible time that DRAM holds onto its data before losing it to leakage is called the charge retention time. Charge retention times in silicon are small, requiring constant refresh cycles, which are not very power-aware. The initial experiments in silicon carbide indicate such times are very long in SiC, making its 1C1T cell ldquo;practicallyrdquo; a non-volatile and static memory unit.In this project, we plan to design and fabricate SiC DRAM and SRAM memory cells, and investigate their potential for use in harsh environments, to pave the way for advanced logging and metrology in extreme environments.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

44 SBIR/STTR records share this UEI (2007–2025). Reported award amounts total $16,309,579. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: National Aeronautics and Space Administration, Department of Defense, National Science Foundation, Department of Energy

Agency intelligence

National Aeronautics and Space Administration

Back to SBIR/STTR Research Awards

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