Real-time Non-destructive Analysis of Aging Effects in Electronic Systems

Aging effects in electronic parts are a major concern for DoD systems that operate in critical applications like missile guidance systems. While proven state-of-the-art testing methodologies that depend on thermal stress are available, they are destructive, time consuming and often inadequate for current generation microelectronics built at deep submicron technology nodes. The CFD Research team proposes to develop non-destructive, rapid, real-time testing and measurement techniques that can improve the accelerated aging test process of new electronic parts before implementation, and allow in situ periodical testing and prediction of aging after implementation. We will design and develop a Real-time Electronic Aging Monitor (REAM) circuit module for in situ periodical testing, a RApid Non-destructive (RAN) accelerated aging test that will mimic nBTI effect in electronic devices without depending on thermal stress, and a Non-destructive Imaging with X-ray (NIX) methodology that will study the composition of gold ions in silicon substrate. The proposed product and processes will be verified with system- and device-under-test that are representative of DoD systems. Their performance will be validated against state-of-the-art destructive methods that use thermal stress and scanning electron microscopy (SEM) imaging. In Phase I, we will focus on proving the concept of the proposed REAM module and RAN aging test, while testing the feasibility of NIX methodology. In Phase I Option, we will further develop and evaluate the NIX methodology towards measuring gold diffusion, while expanding the capabilities of REAM module and RAN aging test. In Phase II, we will focus on developing the REAM module as a product, RAN aging test and NIX methodology as test methods, that can efficiently and rapidly measure aging and predict lifetime.