Materials Based Solution for Enhanced Laser Diode Cooling

Global Technology Enterprises is developing a low thermal resistance laser diode sub-mount, utilizing our commercial CuD, high thermal conductivity spreader material based on a copper matrix with diamond particle additions.  The CuD will be custom processed and finished for laser sub-mount applications which requires development of an ultra sharp edge on the CuD for diode mounting in addition to ultra high Thermal Conductivity up to 2X higher than copper. GTE will collaborate with a leader in the field of Diode laser applications both defense and commercial to develop Air Force applications. These processing steps will uniquely define the defense application of CuD as an advancement over conventional use of CuD as a heat spreader. By repurposing CuD in laser diode sub-mounts and overcoming the technical issues associated with that task,   we can significantly improve the thermal management of laser diode assemblies. The improvement in thermal management of laser diode heat loads will result in laser Diode Pump Modules that can operate at higher temperatures, higher output power, and / or at higher electrical to optical efficiency. The innovations that GTE is developing will improve laser diode performance for both Air Force applications as well as for commercial applications. An improvement in laser diode performance and operating efficiency will enhance the performance of diode pumped fiber laser systems used for Air Force Directed Energy and other applications.