Compact Hyper/Multi-spectral Infrared/Visible Imager Interface Electronics

Cameras for imaging for space are often highly customized for specific applications with long development cycles. The Compact Hyper/Multi-spectral Infrared/Visible Imager Interface Electronics (CHIMInE) will be a rapidly reconfigurable camera electronics board set adaptable to either Visible or Infrared Focal Planes with only a change in the "personality" board. Brandywine Photonics proposes development of these interface electronics for the WeatherSat Visible and Infrared instruments suitable for spaceflight operation, with final delivery being design documentation sufficient for build-to-print manufacturing and an Engineering Development Unit test report. The two electronics sets developed would be for the Low-light CMOS Image Sensor and the Type-2 Strained Layer Superlattice Infrared Focal Plane Array (IRFPA) on a COTS Readout Integrated Circuit. The CHMInIE electronics design should be readily adaptable to other image sensors and infrared Focal Plane Arrays with only minor changes in the sensor personality card and FPGA firmware, depending on the exact specifications on frame rate and format of other sensors. Space flight board manufacturing is not included.