SBIR/STTR Research Award

Low-power High-throughput Talbot Array Scanning Volumetric Lithographic System

Award identifier 5b15599abde6fce57a4f2c0ff2a30e9b18ecb83ced9cf4c8f337dff59c9be10dAwarding agency Department of Energy

Award amount

$200,000

Program and phase

SBIR · Phase I

Award year

2021

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
INTELLISENSE SYSTEMS INC
Proposal award date
2021-02-22
Contract end date
2021-11-21
UEI
C4Y5CNN55L37
Solicitation number
Not reported
Topic code
18a

Research abstract

The science and technology of structuring and miniaturization of material by lithography have been constantly advancing to develop nanoscale and single-digit-micron-scale devices revolutionizing the world with smaller and more efficient transistors, microelectromechanical systems, and metamaterial devices. However, these technologies are based on planar approaches, limiting products to two dimensions. To further this advancement, new and advanced lithographic processes are needed that can extensively pattern materials at the nano/microscale level in three-dimensions. To address this need for new, scalable, rapid, and affordable large-area lithographic approaches to nano/microfabrication in three dimensions, an innovative low-power high-throughput volumetric lithographic system is proposed. The proposed nano/microfabrication in 3D is based on a highly parallel micro-objective lens array design that utilizes a proposer-developed electrically tunable phase-matched liquid crystal microlens array and low-cost commercial off-the-shelf components. Specifically, the innovation in the use of the tunable liquid crystal microlens array and the Talbot grid scanning approach will enable the proposed system to provide a highly parallel, direct laser writing, three-dimensional lithography and overcome the limitations of current direct laser writing approaches, and to provide simultaneous (>10,000) submicron focus spots (voxels), high scan speed (>100,000 voxels/second),largeworkingdistance(>1cm),andlowwritepower(1 cm), large three-dimensional depth (>1 mm), volumetric structures as specified in the project goal. In Phase II, development of a prototype of a volumetric lithographic system that will meet the customer requirements, and demonstration of its capability for low-power, high-throughput volumetric lithography are planned. The proposed rapid, affordable, large-area scalable volumetric lithography approach will enable a multitude of applications ranging from micro-optics, metamaterials, subwavelength optical devices, biomedical tissue scaffolding and imaging, and other tasks unserved by planar lithography or current direct laser writing approaches.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

337 SBIR/STTR records share this UEI (2014–2026). Reported award amounts total $162,560,474. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Homeland Security, Department of Energy, Department of Commerce, Department of Agriculture

Agency intelligence

Department of Energy

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