High Temperature By Design (HTBD) Techniques for a Reliable, High Performance Microcontroller

High-temperature integrated circuits are essential components for enabling distributed engine controls in advanced turbine engines as well as emerging hypersonic platforms. However, supply chain issues demand, and development costs limit part availability, circuit performance, and system adoption. In the Phase I, a commercial-off-the-shelf (COTS) 130nm SOI IC process was investigated to evaluate the feasibility of designing a microcontroller for operation at and above 200C. Using a COTS IC process reduces supply chain bottlenecks and reduces the need for specialized IC process development for the niche high-temperature electronics market. A series of techniques were evaluated for improving the lifetime of electronics. From the simulation results and analysis through the Phase I efforts, a high-temperature 32-bit RISC-V processor capable of over 10,000 hours of operation at 200C or higher was determined to be feasible. For the Phase II effort, the high temperature by design (HTBD) techniques identified will be executed. High-temperature reliability will be quantified by fabricating a test IC and demonstrating high-temperature behavior. Knowledge gained from the test IC will be used to drive microcontroller system reliability and performance. A microcontroller based on a 32-bit RISC-V core will be implemented. The microcontroller will be fabricated and tested.