Packaging Methods for Reliable and Scalable High Temperature Electronics

Expansion of military platforms into the hypersonic realm is pushing needs across a wide variety of systems. The development of hypersonic offense weapons and reconnaissance systems by the US and adversaries in turn is leading to expansion of defensive weapons, such as missile interceptors. Current platforms, such as X-band tracking systems combined with state-of-the-art interceptors have the potential to track and intercept hypersonic systems in the glide phase. As more tracking systems come online, the ability to track and intercept these growing threats leads to the need to improve interceptors to deal with higher, and faster targets. This means the interceptors themselves must deal with the same environments that the hypersonic platforms see ¢ extreme heating due to aerodynamics in systems traveling above 1000 km/s, as well as extreme shock/vibration. The need for electronics that can operate at elevated temperatures under extreme shock/vibration is not limited to missile interceptors. In Phase I, Ozark IC evaluated components and packaging systems developed in conjunction with the USAF, DARPA and DOE for traditional turbine and hypersonic propulsion systems as well as energy exploration for expansion into the challenging hypersonic interceptor regime. These modules, using utilizing silicon (Si), silicon-on-insulator (SOI) and silicon carbide (SiC) components can survive temperature of up to 800oC. A new system based on the best capabilities of these packing systems with enhancements for vibration, shock and high thermal ramp rates was designed and evaluated through simulation and test. In phase II, a clear opportunity exists to complete this system and demonstrate prototypes suitable for ground and eventual flight testing. This will be accomplished through use of unique attachment materials and predicative models developed in Phase I¢ based on measurement and characterization of these materials. The system offers scalability in terms of manufacturing; as it can be utilized through 3D printing systems for rapid prototyping, while using materials compatible with production methods for mass production. All of this offers a unique path to facilitate rapid design and test of new interceptor subsystems. Approved for Public Release | 23-MDA-11635 (9 Nov 23)