Novel Integration Technologies for Infrared Focal Plane Array Application

Alphacore, Inc. proposes to develop a new methodology and novel techniques for integrating infrared focal plane arrays (IRFPAs) in response to the Army’s 19.2 SBIR topic A19-120 entitled “Novel Integration Technologies for Infrared Focal Plane Array Application”. Alphacore will use proven through-silicon via (TSV) technology to realize three-dimensional (3D) hybridization of infrared (IR) sensor arrays and readout integrated circuits (ROICs) that will maximize performance, reliability, and manufacturability of IRFPAs. These benefits will not only provide the Army with a distinct advantage in electronic warfare arenas, they will also minimize cost to the Army for initial deployment and life-cycle sustainment. In Phase I Alphacore will team with NHanced which is a global leader in Direct Bond Interconnect (DBI) technology, a technology that enables high-density (pitch a low as 1um) true 3D stack bonding. 3D integration drastically lowers the parasitics of the interconnect wiring. NHanced’s DBI bonds typically have only 2-3fF of capacitance and less than 3 ohms of resistance. In sensor applications, using DBI rather than micro-bumps has been shown to reduce noise and improve signal gain by 30% or more. Alphacore and NHanced will evaluate and analyze the existing DBI integration technology in the context of IRFPA fabrication: i.e. detector