Integrated Circuit (IC) Die Extraction & Reassembly Automation

Global Circuit Innovations (GCI) will research and develop tools and techniques to evaluate automated manufacturing associated with a variety of die extraction techniques. The main objectives will focus on increasing reliability, volume, yields, and productivity, while simultaneously decreasing lead times and overall cost.  Die Extraction and Re-packaging (DER) and Die Extraction with Electroless Nickel, Electroless Palladium, and Immersion Gold (ENEPIG) Die Pad processing and Re-packaging (DEER) currently generate high return on investment (ROI) solutions for microcircuit obsolescence across the DoD. The die extraction and reassembly automation will be addressed in three distinct process steps: 1.) Chemical and mechanical removal of the silicon die from the original package 2.) Remnant gold ball removal and ENEPIG resurfacing of the original aluminum die pads and 3.) Re-assembly/re-packaging of the new device including die attach, bonding, and lid sealing.These targeted automated process steps will be evaluated to assess and reduce volume manufacturing times in order to meet increased DoD microcircuit needs within weapon systems and larger legacy aircraft fleets such as the F-16, F-15, and C-130.  The effort will identify testing certifications and qualifications related to DoD requirements.  Anticipated results from a robotic, automated platform will optimize manufacturing capability and overall productivity.