Efficient High-Fidelity Modeling of High Strain Thin-Ply Composites

AnalySwift will collaborate with NASA researchers and Prof. Wenbin Yu of Purdue University to establish a new framework for efficient high-fidelity modeling for high strain thin-ply composites (HS-TPCs). Propose innovations include using mechanics of structure genome (MSG) for multiscale constitutive modeling of HS-TPCs, a thermodynamically consistent constitutive model for HS-TPCs exhibiting thermomechanical, viscoelastic, and viscoplastic behavior, and MSG beam/plate/shell models for the efficient high-fidelity modeling of HT-TPC structures. Four tasks will be carried out: (1) demonstrate the advantages of MSG-based modeling framework, (2) develop a thermodynamically consistent constitutive model, (3) develop a MSG thermo-viscoelastic-viscoplastic beam model, (4) develop a MSG thermos-viscoelastic-viscoplastic shell model. The proposed research will address unique modeling challenges (structures coupled with materials, temperature- and time-dependent behavior, geometry nonlinearity at both the material scale and the structural scale) of HS-TPCs in addition to those challenges (anisotropy, heterogeneity, multiscale) associated with traditional composites. The success of this work will significantly advance the design and analysis of HS-TPC structures with a new framework for the efficient high-fidelity modeling of mechanical behavior important for these structures.nbsp;The proposed new modeling capabilities will also be implemented in SwiftCompTM, a general-purpose multiscale constitutive modeling, to maximize the technology transfer.