SBIR/STTR Research Award

Radiation-Tolerant, High Thermal Conductivity Adhesives for High Energy Physics Detector Applications, Topic 31g

Award identifier e36220ad9f4de8b5abf201c9a5b9e34182642dab750c72aeb00431619786f43aAwarding agency Department of Energy

Award amount

$199,956

Program and phase

SBIR · Phase I

Award year

2019

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
COMPOSITE TECHNOLOGY DEVELOPMENT, INC.
Proposal award date
2019-07-01
Contract end date
2020-06-30
UEI
X57TKFLL14E5
Solicitation number
DE-FOA-0001941
Topic code
31g

Research abstract

High Energy Physics experiments utilize highly specialized detector systems that are dimensionally stable and have very low mass to reduce the detected particle scattering. Current detector systems make significant use of adhesives in assembling the components of the system. In order to meet future requirements, radiation-tolerant adhesives with high thermal conductivity are needed; a room temperature thermal conductivity on the order of 4 W/m-K is desired. Composite Technology Development, Inc. (CTD) will explore multiple pathways to increasing the thermal conductivity of resin systems used in composite fabrication and adhesive systems. Primarily, CTD will be focusing on resin systems known for their radiation tolerance (e.g., cyanate ester). High thermal conductivity fillers such as aluminum nitride and graphene will be considered in addition to structured nanoscale materials such as carbon nanotubes. In order to improve the detector’s accuracy, the filler radiation length should be optimized so that particle scattering is minimized. The objective of this Phase I SBIR effort is to develop a radiation tolerant adhesive formulations with high thermal conductivity to specifically address requirements unique to high energy physics detector applications. This objective will be accomplished by evaluating low mass, high thermal conductivity nanoparticle fillers dispersed in radiation-tolerant resins compatible with adhesives applications. Filler selection and loading level will be guided by a combination of thermal conductivity modeling and prediction of system radiation length to minimize particle scattering. Adhesion performance of candidate materials will also be evaluated.This program provides a generalized approach to thermal management in composites and adhesives. Thermally conductive resins are expected to enhance the performance of detectors in high energy physics experiments, ultimately leading to improved particle detection applicable to medical and other advanced imaging applications. Applications are also expected in next- generation, higher field superconducting magnets, based on newer high temperature superconductors (HTS), where quench protection is critical for reducing risk. Additional application areas include the aerospace industry (e.g., satellites, space-based antenna systems) and advanced electronics.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

148 SBIR/STTR records share this UEI (1987–2024). Reported award amounts total $51,861,396. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, National Science Foundation

Agency intelligence

Department of Energy

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