Die Extraction and Reassembly of Hybrid Photonic Integrated Circuits

With the growing complexity of ICs, interconnects become a bottleneck due to parasitics that cause cross-talk, wave reflection phenomena, and timing inaccuracies.Rapid advances are being made in utilizing optical interconnects in ICs where high speed signaling and routing are extremely important. Optical interconnects have advantages of high interconnect density, low energy consumption, and high speed timing capability. In this proposal, we plan to study die extraction and reassembly (DER) of hybrid photonic integrated circuits to replace passive devices and obsolete packaged ICs on a circuit board to increase high-speed routing of information in packaged ICs.DLP7000, a popular Digital Micro-mirror Device from TI is chosen for demonstrating the DER process in this phase 1.The DLP7000 is used widely in displays, medical devices, lithography, and 3D printing and serves a versatile model containing optical, mechanical and electronic components.We plan to accomplish the DER through a comprehensive and systematic approach where we will a) initially assess and develop suitable DER techniques, then; b) refine and re-evaluate, as needed and finally; c) implement the DER of the selected photonic IC on Si substrate and perform testing to full compliance with MIL-STD-883.