HEAT: High-temperature Electronics in Advanced Thermostructures

The HEAT (High-Temperature Electronics in Advanced Thermostructures) project addresses NASA’s critical need for additively manufactured electronics (AME) capable of operating in extreme thermal environments (500°C–800°C). Future missions to Venus, solar probes, and high-temperature propulsion systems require structurally embedded electronics that can withstand prolonged exposure to extreme conditions without bulky shielding or cooling systems. Traditional space-grade electronics degrade at these temperatures, necessitating innovative AME solutions for long-duration survivability. HEAT leverages Direct Ink Writing (DIW) and laser-etched vias to integrate high-temperature conductive pathways such as tungsten into ceramic matrix composites (CMCs) and carbon-carbon (C/C) structures. This enables sensor integration, power distribution, and signal transmission directly within spacecraft materials, eliminating failure-prone mechanical interconnects. Unlike conventional wire-bonded electronics, HEAT’s embedded architecture provides superior thermal stability, mechanical robustness, and reduced mass, allowing mission-critical electronics to function in Venus-like and solar probe conditions.