Die Extraction and Reassembly of Integrated Circuit Modules on Low Temperature Co-Fired Ceramic Substrates

This Phase I SBIR proposal addresses the Diminishing Manufacturing Sources (DMS) using the process of Die Extraction and Reassembly (DER). The DER process takes an IC die equivalent to the obsolete die from an undesirable and outdated package and reassembles that die into the needed package, hybrid or MCM. DER is an innovative and cost effective alternative solution to other higher cost solutions such as redesign of obsolete ICs. The tools, techniques, and knowledge needed to certify DER parts for military use are still under development. Innovations, as proposed in this project, would lead to tools and techniques that will eventually result in a certification process similar to those in place for MIL-STD-883 compliant parts. Key aspects of Phase I of this program are as follows: 1. Die Extraction of a complex high pin-count plastic package. 2. Reassemble extracted die on LTCC Substrate along with passive components towards a self-contained Multi-Chip Module (MCM), with embedded passive components and thermal management structures. 3. Perform MIL-STD-883 compliant testing such that the new part created from DER process meets or exceeds all military standard specifications. 4. Develop transition plan/business case analysis, with industry partners.