Rapid High Throughput Laser Assisted Die Extraction and Reassembly of Integrated Circuits

The U.S. Department of Defense (DoD) continually faces Diminishing Manufacturing Sources and Material Shortages (DMSMS) due to obsolete electronics. In recent years, U.S. DoD is faced with another significant concern with the diminishing trusted sources for high performance microelectronics. In this SBIR project, we propose a complete supply-chain to provide both rapid response and high-throughput Die Extraction and Reassembly (DER), starting from receiving the Integrated Circuit (IC) requirements from U.S. Air Force (AF) to providing the complete finished and tested solution to U.S. AF in the shortest amount of time. We will specifically focus on microcontrollers. We will further optimize our laser-based IC decapping process in terms of laser power, scan area and scan speed. We plan to design, assemble and test an integrated laser decapping and chemical etching system that allows rapid and high-throughput DER processing of the ICs. The extracted ICs will be tested for the MIL-STD-883 specifications. Finally, we will work to develop a new Low Temperature Co-fired Ceramic Multi-Chip Module based on specifications from U.S. AF. We will assemble a MEMS resonant vibration sensor underneath the harvested new DER IC to listen to specific acoustic vibrations made by the microcontroller towards a trusted electronics solution.