Printable Materials with Embedded Electronics and Radio Frequency Components

To reduce size, weight, power and cost (SWaP-c), military platforms have been evolving towards a more integrated design approach that efficiently utilizes all available space. In fact, to accommodate limited space constraints many commercial off-the-shelf (COTS) systems will need to be replaced by custom designed and fabricated components. For radiofrequency (RF) electronic systems, this will require exploring innovative design methods, new materials and novel manufacturing approaches to realize cost-effective, customizable and conformal RF devices. In this effort, we will apply a multi-material based AM approach. The overall goal is to use a single AM system to fabricate functional Ku-band RF front ends with integrated amplifiers, mixers and active beam steering. Specific objectives include; 1) design and fabrication of printed connectors, 2) explore advanced dielectric substrate materials including high temperature and fire resistant polymers, high strength composite polymers and high dielectric constant printable polymers, 3) integrate active RF circuitry including low noise amplifiers, mixers and phase shifters, 4) explore methods for thermal management of active components including printed embedded heat sinks and micro-fluidic devices and 5) integrate the various printed RF components together to realize both a planar and conformal Ku-band RF front end with integrated amplifiers and active beam steering.