Printed Materials with Embedded Electronics and Radio Frequency Components (1000-409)

SI2 Technologies, Inc. (SI2) proposes to accelerate development of printed (i.e. additively manufactured), passive, planar, multifunctional Ku-band arrays for Army radar and other Army applications.These arrays have specific application to the Armys Modular Missile Technologies (MMT) program and fielded missiles, such as Hydra, Talon, Stinger, and DAGR.Specifically, SI2 will advance the prototyping of RF and DC connectors that will be embedded in the Phase II printed arrays.These multifunctional arrays will be designed to serve both an RF role (data Tx/Rx) and a structural role, improving SWAP-C.SI2 offers a unique combination of additive manufacturing experience and RF design expertise for the development of cost-effective, printed radar arrays with integrated connectors. In Phase II, SI2 will incorporate printed RF components, printed RF connectors, and printed low-loss microwave PC board material into its Ku-band array design.The SI2 team will then demonstrate and evaluate a prototype of an embedded 8-element Ku-band RF front end with RF connections.