SBIR/STTR Research Award
Low-SWAP-C, Radome-Integrated Printed Antennas for Hypersonic Weapons (1000-550)
Award amount
$1,699,768Program and phase
SBIR · Phase IIAward year
2020Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- SI2 TECHNOLOGIES, INC
- Proposal award date
- 2020-04-30
- Contract end date
- 2023-09-24
- UEI
- YUNJQSCD2Z99
- Solicitation number
- 16.1
- Topic code
- A16-006
Research abstract
SI2 Technologies (SI2) proposes to develop printed, shape-conformal antennas integrated with hypersonic vehicle radomes. The antennas’ conformality to the vehicle airframe will allow precious onboard space and weight to be reallocated and/or will facilitate increased weapon range. SI2 offers unique combined expertise in RF design and additive manufacturing of extreme-environment antennas. SI2’s Phase II effort will culminate in the development of an advanced antenna demonstrator printed using high temperature materials. The RF performance of the Phase II demonstrator will be validated under simulated flight conditions. With support from industry partners, SI2 will identify opportunities to transition its printed antenna technology to the DoD.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Affordable Wideband Scalable Front-End Electronics Supporting Multi-Function Seekers (PROP.SI2T.RADR.03)
- Antenna Distribution System
- Novel Tri-Band Antenna to Enable Enhanced SM-3 Communications (1023-012-007)
- High-Dynamic Range Weather Band Active Electronically Steered Array with Virtual Gimbal (1023-014-002)
- Direct Write Frequency Selective Surfaces for Hypersonic Applications (B&P No. PROP1.SI2T.EW01.07)
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Additively Manufactured Radomes
- Printable Materials with Embedded Electronics and Radio Frequency Components
- Printable Materials with Embedded Electronics and Radio Frequency Components
- Printed Materials with Embedded Electronics and Radio Frequency Components (1000-409)
- Printable Materials with Embedded Electronics and Radio Frequency Components
Research funding history
121 SBIR/STTR records share this UEI (2003–2025). Reported award amounts total $61,586,541. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration