Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress related failure. Specific outcomes include; (a) experimental evaluation of adhesive bond performance under thermal stress conditions, (b) development and application of a testing protocol to quantify the coefficient of thermal expansion (CTE) mismatch necessary to elevate stress to cause degradation, (c) physics based models to simulate thermo-mechanical stress between bonded components, and (d) a fine scaled physics based damage model to relate thermo-mechanical stress to damage progression. This effort includes the development of the test and modeling protocols, generation of data to parameterize models and application of the models to the study of thermal fatigue in adhesive bonded components. The end use of the modeling and testing protocol is to extract design rules and materials selection guidelines to allow MDA and its prime contractors to mitigate component failures related to CTE mismatch through improved designs and materials selection and with reduced long-duration cyclic testing.