Novel Reactive Defect Reduction Polishing Technology for Scalable Production of ElectronicDiamond Wafers

The low cost manufacturing of high quality, electronic grade single crystal and poly crystal diamond wafer depends on development of scalable, defect reduction growth and polishing methods. Sinmat has developed novel scalable polishing methods that create damage free surface and eliminate sub-surface damage.By working together with leaders in diamond growth, diamond wafer with low defect density, low surface roughness will be obtained. Furthermore the scalable nature of the growth and polishing process will ensure significant reduction in manufacturing costs in the future.