Enabling Flexible Materials, Devices and Processes for Defense
Award amount
$1,349,974Program and phase
SBIR · Phase IIAward year
2014Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- AMERICAN SEMICONDUCTOR, INC
- Proposal award date
- 2014-02-21
- Contract end date
- 2017-05-26
- UEI
- C1BNR9HJBQK8
- Solicitation number
- 2012.1
- Topic code
- AF121-003
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Ultra-thin Conformal Electronic System Development and Characterization
- ForeWarm: FHE Microclimate Heating System for Strength and Dexterity
- ForeWarm: FHE Microclimate Heating System for Strength and Dexterity
- FleX-3D Wafer Processing for Chip Stacking and Interconnect
- Conformal Load Bearing Antenna Structure
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Direct Printing of 3D Structural RF Electronics
- Direct Printing of 3D Structural Radio Frequency Electronics
Research funding history
22 SBIR/STTR records share this UEI (2002–2025). Reported award amounts total $8,230,994. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration