SBIR/STTR Research Award

Enabling Flexible Materials, Devices and Processes for Defense

Award identifier 9d8b7faaaaa9cfdb895caa7f7e59cba044a69c596309d3ecc15098fa93a6a2efAwarding agency Department of Defense · Air Force

Award amount

$1,349,974

Program and phase

SBIR · Phase II

Award year

2014

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
AMERICAN SEMICONDUCTOR, INC
Proposal award date
2014-02-21
Contract end date
2017-05-26
UEI
C1BNR9HJBQK8
Solicitation number
2012.1
Topic code
AF121-003

Research abstract

ABSTRACT:Emergence and feasibility for flexible body-worn electronics and particularly medical patches requires high performance electronics capability.The problem is that these new technologies must have flexible and conformal physical formats and conventional electronic components are not in any way flexible. In the CLAS Phase I program, a new flexible high-performance manufacturing and materials system was demonstrated for feasibility.This system included high performance components integrated with printed substrates and printed antennas to support data processing and wireless communications in a flexible and conformal format. FleX silicon-on-polymer integrated circuits and printed devices such as the antenna demonstrated in the CLAS Phase I program have provided a feasible solution for flexible electronics and wireless applications.This Phase II will build on the Flexible Hybrid System (FHS) technology proven in the CLAS Phase I and will apply the technology to body-worn and bio-sensor applications. The output of this Phase II will be the manufacturing and materials methods required for producing this technology.The program includes the demonstration of the new capability with the production of FHS development kits that can be utilized to enable a wide variety of programs that demand high performance flexible electronics. The program includes an applied demonstration of the new capability by integrating an advanced printed ammonia biosensor on completed development kits.BENEFIT:BENEFITSManufacturing capability for CLAS and other distributed sensor defense applications.Development Kits that can be used by sensor/product teams developing body-worn electronics.Establishment of U.S. manufacturing capability at the leading edge of flexible electronics.Development of new flexible electronics assembly capability and technology.Development of new flexible electronics materials.COMMERCIAL APPLICATIONSMajor commercial products companies desire to introduce ultra-thin and flexible consumer and medical electronics to the market. This includes products with flexible OLED displays, body-worn sensors, smart clothing with wireless communication and the conversion of a number of common devices such as tablets and cell phones to flexible versions.The technology in this Phase II is enabling for all of these applications.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

22 SBIR/STTR records share this UEI (2002–2025). Reported award amounts total $8,230,994. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration

Agency intelligence

Department of Defense

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