Ultra-thin Conformal Electronic System Development and Characterization

The project will initially produce the proof-of-concept (POC) Demonstrator that will be used as a basis for development of conformal electronics with capability and reliability optimized for the DARPA conformal application. An application Prototype will then be developed using the demonstrated advanced technology capability to support DARPA’s conformal requirements. The designs for the POC Demonstrator and the application Prototype will be provided by ASI in support of DARPA requirements determined in project meetings of ASI and DARPA. The Demonstrator will be composed of COTS “off-the-shelf” SoP packaged ICs and conventional surface mounted devices (SMT) on advanced Ultraflex or Nobleflex flexible printed circuit boards (FPCB) to demonstrate and validate capability, functionality and reliability. An application Prototype will be designed and utilize results from the Demonstrator development. The Prototype will focus on DARPA’s conformal application and will include purpose selected devices and ICs packaged in conventional configurations, packaged in ultra-thin SoP-TM, or provided in a specific DARPA identified format. The devices and ICs will be assembled on advanced FCPB using the best reliability materials and processes verified by the Demonstrator evaluation. The application Prototype will be characterized for reliability by ASI utilizing the SOTA harsh environment in situ test capability for flex assemblies. The comprehensive SOW is defined in detail and supported with milestones and GFY spending schedules.