SBIR/STTR Research Award

Direct Printing of 3D Structural RF Electronics

Award identifier d98fd0984eccf086b2fd4630380bea0fbeb46ee2e87d4cc2209571e9e8a2f915Awarding agency Department of Defense · Air Force

Award amount

$749,971

Program and phase

SBIR · Phase II

Award year

2014

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
Sciperio, Inc.
Proposal award date
2014-02-26
Contract end date
2016-05-23
UEI
GKUVEK4HMMZ8
Solicitation number
2012.1
Topic code
AF121-003

Research abstract

ABSTRACT: Using the advantages of 3D printing, an antenna system wing structure will be printed. The antenna system will be a multi-layer electronic device with a number of antenna elements. The electronics will not be mounted to the wing structure, they will become part of the wing structure. This implies an impact to Size, Weight and Power (SWaP) for UAVs. The payload will become part of the wing structure allowing the rest of the UAV to be utilized for more fuel for longer flights. The electronic portion of this must operate in the RF regime and the success of Phase I demonstrated a numbering of working devices utilizing 3D printed materials and including ring resonators and multi-bit phase shifters. This is the first time a complex RF system will be printed utilizing 3D printing and Direct printing approach. This will enable UAVs but also enable a vast number of 3D RF products. BENEFIT: The anticipated benefits will be enhanced capabilities in smaller UAVs that could rival the large complex, expensive crafts. These small UAVs with printed phase array system wings will provide more intelligence and surveillance capabilities to a broader range of war fighters at less cost to the DoD. This will be a significant savings to the DoD when this is fully utilized and expanded beyond UAVs and into other electronic devices that are deployed. This will transition beyond the DoD and move to enable consumer electronic products. The complexity of this project is significant as compared to more simplistic but mass produced consumer electronics. Next generation consumer electronics will be customized, personalized and be enabled via 3D printing. The potential of manufacturing in the U.S. will become a reality when this matures.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

40 SBIR/STTR records share this UEI (1998–2025). Reported award amounts total $11,241,921. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration, Department of Health and Human Services, Department of Transportation

Agency intelligence

Department of Defense

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