High Thermal Conductivity, Radiation Resistant Adhesive for High Energy Physics

The proposal addresses a demand in High-Energy Physics for radiation-insensitive high-thermal-conductivity adhesives. Adhesives play an active role in keeping electronic devices cool by conducting heat away, thus increasing reliability. A radiation-tolerant adhesive exhibiting high thermal conductivity is strongly desired. Surmet proposes to develop a novel adhesive formulation that uses Aluminum Nitride (AlN) as a high-thermal-conductivity filler. AlN is radiation insensitive and possesses a thermal conductivity four times greater than carbon steel. Surmet is the only US-based company that manufactures AlN in multiple grades it has produced and commercialized AlN in tonnage quantities for over 15 years. Our objective is to develop, test and fabricate prototypes of the adhesive in Phase I. The subsequent Phase II would focus on scale-up and manufacturing procedures. Our adhesive will be tested at service conditions. Some field testing may be performed in cooperation with research institutes such as FermiLab. Commercial Applications and Other Benefits: In addition to High-Energy Physics, Surmets high-thermal-conductivity adhesives will be applicable to electronics thermal management, not only providing excellent heat removal performance, but also will provide improved reliability and be better suited for electronics system manufacture. Successful development of our concept for the above applications will be directly applicable to wide range of thermal management applications, serving a variety of military and industrial power electronics, optics/laser, telecommunications, and thermonuclear fusion power generation hardware markets.