SBIR/STTR Research Award

Scalable, Wide Bandgap Integrated Circuit Technology for Wide Temperature, Harsh Environment Applications

Award identifier 45ed4ccda752901261e1fbc52709e850cbfd62c9dc4ab0e1d3954f033f17cf46Awarding agency Department of Defense · Air Force

Award amount

$149,959

Program and phase

SBIR · Phase I

Award year

2013

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
Sensor Electronic Technology, Inc.
Proposal award date
2013-06-05
Contract end date
2014-03-05
UEI
ZLAMG4KBKN15
Solicitation number
2013.1
Topic code
AF131-166

Research abstract

ABSTRACT: We propose to develop novel high-temperature robust control ICs compatible with power SiC device using on insulated gate III-Nitride transistors MISHFETs - over SiC native nitride substrate. SET Inc patented GaN MISHFET technology offers radical device performance improvement over SiC MOSFETs and other device types in terms of transconductance and speed of response, due to an extremely high electron sheet density and high electron channel mobility at AlInGaN/GaN heterointerface, the feature not available in SiC technology. Electron concentration and mobility in two two-dimensional channels are remarkably stable within broad temperature range, spanning from cryogenic up to 500°C or even higher. Gate dielectric incorporated into MISHFET design enables low gate leakage currents and is a key feauturesfeature for achieving high reliability in a broad range of operating temperatures. Highly controllable SET Inc. patented MEMOCVDTM MEMOCVD growth and fabrication processes will ensure high MISHFET yield exceeding at 60%. The use of technologies and manufacturing capabilities readily available at the proposer"s facilities guaranties rapid commercialization and system insertion of these novel devices leading to transformative changes in the SiC and other power devices control ICs employed in Air Force and other DoD branches as well as in a broad range of commercial applications. BENEFIT: The successful completion of the proposed Phase I work will yield robust high-temperature GaN MISHFET usable in high-temperature control ICs. The realization of the proposed novel technology will lead to transformative changes in the aircraft electronics significantly increasing the operating temperature of the complex blocks including control circuits and power switches. This will also greatly simplify the system thermal management, reduce the system weight and increase the reliability. The developed control ICs can also be used to operate with other types of power electronic blocks used in different DoD branches as well as in a broad range of commercial applications.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

80 SBIR/STTR records share this UEI (1984–2014). Reported award amounts total $19,732,151. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Science Foundation, Department of Health and Human Services, National Aeronautics and Space Administration, Department of Agriculture

Agency intelligence

Department of Defense

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