SBIR/STTR Research Award

Ultra High Performance Radar Absorbing Material for Anechoic Chambers (1000-200)

Award identifier f6c6b433d002f0b5dca23e11a85251d18aa7cd7c2501c4f075a4e66d940bb4e5Awarding agency Department of Defense · Air Force

Award amount

$149,992

Program and phase

SBIR · Phase I

Award year

2012

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
SI2 TECHNOLOGIES, INC
Proposal award date
2012-01-04
Contract end date
Not reported
UEI
YUNJQSCD2Z99
Solicitation number
2011.2
Topic code
AF112-195

Research abstract

ABSTRACT: SI2 Technologies, Inc. (SI2) proposes to design and develop a high performance, structural radar absorbing material (RAM) from Direct Write printed product, for use in the Benefield Anechoic Facility (BAF). SI2"s innovative RAM is manufactured using a digital process which enables the creation of 3D absorbers of any size, shape or geometric orientation to be manufactured. The Direct Write process also allows different concentrations of resistive material to be deposited within the absorber, further increasing the design space by enabling multi-tiered or layered designs. In Phase I, SI2 will design and model a RAM structure that integrates with the Direct Write process to not only meet the electrical and fire resistance requirements for use in the BAF but also to provide robust structural and damage resistant properties, due to its unique design. In the follow-on Phase II, SI2 will build on the Phase I results to refine and optimize the design of the RAM. Prototype RAM articles will be manufactured to support RF evaluation in an anechoic chamber. BENEFIT: The initial assessment of the proposed structural RAM, manufactured from Direct Write inkjet printed material, indicates the potential of the technology to be used in applications beyond those targeted for the BAF in this Phase I effort. With the continued evolution of low observable requirements on legacy and future aerospace vehicles, new technologies are required to push the design and manufacture beyond state of the art as new threats emerge. LO designs are frequently limited by the ability of manufacturing processes, such as dip or flow coating, to create the proper impedance matching due to their inherent inability to locally tailor the RF response. SI2"s use of Direct Write deposition to manufacture complex, highly tailored, net shape RAM will enable designers of low observable structures almost limitless design options.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

121 SBIR/STTR records share this UEI (2003–2025). Reported award amounts total $61,586,541. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration

Agency intelligence

Department of Defense

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