Large Format Dual Band FPA ROIC for Low Flux Environments

In Phase-I of the project we constructed a unique ROIC design based on our Amplifier-Shared-Dual-Band CTIA (ASDBC) technology to address the problems experienced by the existing ROICs. In Phase-II, we will refine and complete the design, manufacture the ROIC, fabricate the FPA, and test the completed product. One application issue presented by the DBCHI is the large gain variation across the array. Though off-chip gain adjustment is possible, an on-chip solution is highly preferred because of noise and dynamic range consideration. This technology will have to be added to the current ROIC design to compensate for this condition. A complete ROIC, including the peripheral electronics and supporting software will be manufactured in Phase-II based on the proposed technology. A prototype 640x480 ROIC chip will be fabricated as a proof of the design. The functionality and performance of the prototype product will be examined and characterized. Potential problems and secondary effects will be analyzed as well and counter action will be taken accordingly. Successful Phase-II work will lead to the delivery of a dual band, low light level ROIC for military use and commercial applications.