Direct Write Inkjet Printing of Miniature Sensors on Flexible Substrates (1000-160)

In Phase I, SI2 Technologies utilized inkjet printable dielectric, resistive, conductive, and a semi-conductive inks to demonstrate the feasibility of using a wide format, roll to roll inkjet printing process to manufacture low cost, high volume printed complex electronics and electronic circuitry. In Phase II, SI2 will build on the successful Phase I by using a combination of inks to print planar interdigitated capacitors, spiral inductors, resistors, transmission lines and antenna elements. Front end circuitry consisting of antennas, bandpass/lowpass/highpass filters, and power dividers/combiners can be produced resulting in circuit electronics optimized to minimize losses through impedance matching while maintaining their flexible, extremely low profile form factor thereby mitigating constraints using conventional printed circuit manufacturing including ridged back supports and strain relief. One demonstration article incorporating at least two of the sensors evaluated during Phase II will be manufactured and characterized. Manufacturing data will be used to create a cost model to project near and long term costs of the SI2 Direct Write inkjet printed product. SI2 will review the data obtained during the course of the Phase II effort to assess the state of the technology and develop a roadmap to successfully transition it to Army and other DoD platforms.