Advanced Space Sensor Components and Concepts

This proposal concerns “Advanced Space Sensor Components and Concepts" and describes a revolutionary approach to cost reduction by temporarily hybridizing HgCdTe Focal Plane Arrays (FPAs) to silicon Read Out Integrated Circuits (ROICs). For each program, a “good” Silicon Read Out Integrated Circuit (ROIC) will be identified, and subsequently used as a “Master” ROIC which will be used repeatedly to test all HgCdTe arrays for that program. The “Master” ROIC will be temporarily hybridized to each large area HgCdTe array. Testing will then proceed and the array will be exercised and data such as percent operability, NEI, etc. will be measured as is normally done. If the array is acceptable by electrical testing, the temporarily hybridized “Master” ROIC will be removed without damaging either the HgCdTe array or the ROIC. If the sensor array meets program specifications it will then be permanently bonded to a good ROIC using indium bump technology, as is currently done in standard manufacturing. We will explore two different methods to achieve temporary hybridization. The proposal will clearly describe both methods.