SBIR/STTR Research Award

Electrically Conductive Hot Melt Adhesives for Rapid Aerospace Fastener Preparation

Award identifier 02c82758f9bcad9ff00d58c14e9e36b8d57111eb2bb91a686982d908e6d45a7aAwarding agency Department of Defense · Air Force

Award amount

$2,249,970

Program and phase

SBIR · Phase II

Award year

2010

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
LUNA INNOVATIONS INCORPORATED
Proposal award date
2010-06-29
Contract end date
2012-08-30
UEI
SJHFCDGKJJC5
Solicitation number
2008.1
Topic code
AF081-039

Research abstract

The current practice for joining airframe structures together involves a costly and labor intensive process. Fasteners are often conversion-coated, primed, and sealed with an electrically conductive hot melt material. The existing hot melt material provides adequate conductivity, but is expensive, lacks the flexibility needed for long term durability, and takes several minutes to apply to each fastener location. In order to reduce manufacturing costs, a new hot melt material is needed that is less expensive, has a shorter application process, and greater in service durability. To address the need for an improved fastener fill material with the combination of excellent mechanical properties and conductivity, Luna Innovations is developing an electrically conductive hot melt adhesive by combining unique conductive fillers with novel hot melt adhesives. By combining both structural adhesive aspects including optimum adhesion and flexibility, and electrical conductivity, the Luna hot melt will save on materials costs, installation time, repair costs, and overall aircraft cost. BENEFIT: Luna’s innovative solution will save direct and indirect costs while accelerating aircraft production. By reducing the time it takes to install the hot melt adhesive and improving overall field performance and durability, significant benefits will be realized. An extension in service life will translate into savings for both time and labor expenses as well as raw material costs. Example applications can be found in all branches of the military (Air Force, Army, Marines, Navy) on structures (especially organic composites such as aircraft wing lay-ups) and in numerous commercial construction/structural applications where rapid deployment of a conductive hot melt adhesive is beneficial.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

994 SBIR/STTR records share this UEI (1991–2026). Reported award amounts total $336,438,763. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Health and Human Services, National Science Foundation, Environmental Protection Agency

Agency intelligence

Department of Defense

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