Fast, High Resolution 3-D Flash LIDAR Imager

Mine and obstacle detection in very shallow water and through the surf-zone is an extremely challenging technical problem. A recent Navy system uses a 3-D LIDAR employing an image tube with a GaAsP photocathode and an anode based on a silicon PIN diode array bump bonded to a ROIC. The Navy system also uses a range-gated camera for more accurate image analysis at specific water depths. Pacific Microchip Corp. proposes replacing the two sophisticated cameras with a high resolution, light, robust, and low cost monolithic 1024 x 1024 pixel, 56 ranging bin 3-D imager. High light sensitivity, built-in anti-blooming, and wide dynamic range offer high image contrast and effective rejection of the solar and laser glints. A novel data serialization simplifies interfacing at low power consumption. A unique imager topology permits combining four focal planes to build a 4.2M pixel 3-D imager panel for future Navy missions. The proposed ASIC will be manufactured on 200mm CMOS wafers. During Phase I a circuit design and in silico validation of the imager will be provided. Phase II will result in a product ready for commercialization in Phase III.