Low Cost Automated Module Assembly for 180 GHz Devices

Despite the obvious advantages of millimeter wave technology, a major barrier to expanded use is high assembly costs due to: need for specialized equipments; need for precision impacts on yields; design technologies for manufacturability; and experienced personnel with demonstrated track records. The challenges of this R&D project are to expand and fully develop the Phase 1 technologies for: • Methods to use common manufacturing equipment to achieve the high accuracy die placement required for millimeter wave frequencies (+/- 5 micron accuracy) • Automation methods and processes to achieving speed and precision for production of low cost modules • Modeling to arrive at cost effective trade-offs for achieving customer specifications with minimum capital investment and labor cost As part of the research, NxGen will conduct a demonstration effort utilizing two existing JPL module designs facilitating the collection statistical data both in terms of yields as well as baseline data for cost estimating.