SBIR/STTR Research Award

A Reliable Electronic Package for Space Exploration

Award identifier 2acaf18505a6d9cfcbe393d107412cc3b1085bf6874e95ce1160ebc28d6759f0Awarding agency National Aeronautics and Space Administration

Award amount

$600,000

Program and phase

SBIR · Phase II

Award year

2010

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
SIENNA TECHNOLOGIES, INC.
Proposal award date
2009-11-10
Contract end date
2011-05-31
UEI
W8VZALJ8J617
Solicitation number
Not reported
Topic code
X1.03

Research abstract

The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

61 SBIR/STTR records share this UEI (1993–2017). Reported award amounts total $13,380,891. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, National Science Foundation

Agency intelligence

National Aeronautics and Space Administration

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