Novel Device Processes For Anti-tamper Applications

Irvine Sensors Corporation (ISC) will work together with a prime supplier of U.S. military weapon systems to integrate the new "strain-driven" interconnect approach for Anti-Tamper applications developed in Phase I. This approach is integrated with Irvine Sensors patented stacked die process for developing 3-Dimensional components. ISC''s previously developed MDEM Anti-tamper device will be modified with the new "strain-driven" interconnects called "SAILS" (Secure Anti-tamper Integration Layer Security). The SAILS device incorporates field-programmable gate arrays (FPGAs), memory (FLASH die), processors, and a variety of sensors. Test methodologies developed for the SAILS device support the concept to the prevention of reverse engineering efforts. Fabrication approaches developed in Phase I will be integrated in the development of the SAILS device. An insertion plan for the SAILS device with the Prime contractor will be identified and developed. BENEFIT: Our device can be integrated into both military and commercial markets where protection of critical information is required. The design of our device from this effort will be beneficial to multiple Lockheed Martin weapon system programs benefiting the war fighter on the battle field.