Novel Device Processes For Anti-tamper Applications

Irvine Sensors Corporation (ISC) will work together with a prime supplier of U.S. military weapon systems to develop a new “strain-driven” interconnect approach for Anti-Tamper applications. This approach will integrate with Irvine Sensors patented stacked die process for developing 3-Dimensional components. We plan on modifying ISC’s MDEM AT device components with the new “strain-driven” component interconnects called “MDEM-3D”. The MDEM-3D device incorporates field-programmable gate arrays (FPGAs), memory (FLASH die), processors, and a variety of sensors. Test methodologies will be developed with the new MDEM-3D device supporting the concept in the prevention of reverse engineering efforts. Fabrication approaches will be developed with the prime for prototype development in Phase II and an insertion plan after the Phase II. BENEFIT: Our device can be integrated into both military and commercial markets where long an active storage life is required. Prime contractors have been identified and are interested in working with this technology for insertion into their current and future U.S. weapon systems as a “key technology”.