SBIR/STTR Research Award
Reduced Power Electronics Subassembly Size, Weight, and Footprint Using Silicon Carbide and AC-link Technology
Award amount
$1,178,090Program and phase
SBIR · Phase IIAward year
2009Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- PRINCETON POWER SYSTEMS, INC.
- Proposal award date
- 2009-01-21
- Contract end date
- 2012-07-14
- UEI
- Not reported
- Solicitation number
- 2007.2
- Topic code
- N07-130
Research abstract
In Phase II, we will deliver a 50 kW, 50 kHz, medium voltage AC to 700 VDC power converter using a high-frequency, low-leakage inductance internal transformer and 6 kV silicon carbide (SiC) gate-turn-off thyristors (GTOs) to demonstrate these technologies and how they solve the technical risks. The high power density (2-3 MW/m^3) and high efficiency (96-98%) required by future Navy propulsion drives and power distribution networks will be achieved by soft-swiching SiC devices at 50 kHz with the proprietary Princeton Power Systems AC-linkTM power conversion topology. Conventional silicon devices cannot achieve the high speeds and high voltages required to reduce the transformer size and weight to the levels that are required for the next generation of electric ships. Our Phase I program proved the feasibility of joining AC-link with SiC devices to achieve a 1.5 MW, bidirectional, 6.9 kVAC to 700 VDC converter with internal transformer, 98% efficiency, 3.3 MW/m^3 power density, less than 1 msec fault-current interruption, and MIL-STD 1399 power quality. The study identified the risks remaining and identified commercial applications that will reduce Navy acquisition costs. We have obtained a $1.0 million investment commitment for our Phase III commercialization effort. Prof Jian Zhao of the Rutgers University SiCLAB will consult.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- High Power Density Power Electronic Devices and Components
- Reduced Power Electronics Subassembly Size, Weight, and Footprint Using Silicon Carbide and AC-link Technology