Reduced Power Electronics Subassembly Size, Weight, and Footprint Using Silicon Carbide and AC-link Technology

We will design, develop, and deliver a 4160 V, 100 kW converter with a power density of 3 MW/m3,through the integration of silicon carbide (SiC) thyristor devices operating in an AC-link topology. Unlike other state-of-the-art converters, AC-link can use thyristor devices and, therefore, avoid the reliability problems with the SiC oxide layer found with turn-off devices (IGBTs). SiC devices with an 8 kV voltage rating and 300°C junction temperature significantly reduce the size, weight, and footprint of the bridge and heat sink. Furthermore, SiC thyristors and AC-link enable a high operating frequency, which minimizes the size and weight of passive components. During Phase I we will model the converter’s operation over a wide range of conditions and use the results to complete a detailed design of the bridge, heat sink, inductor, and capacitor subassemblies, including component selection, cooling, assembly considerations, and voltage isolation. In the Phase I Option, we will design the enclosure and component layout and obtain quotes from contract manufacturers for each subassembly. In Phase II we will build a system demonstrating the power density and performance of the converter and optimized subassemblies. GHO Ventures has expressed interest in our Phase III manufacturing effort.