Scanning X-Ray Diffraction Microscope

Advancements in compound semiconductor manufacturing call for a constant growth in the complexity of its materials and nanostructures. The Air Force Research Laboratory Sensors Directorate (AFRL/SN) is seeking novel imaging tools and techniques, as well as image analysis and processing methods, which will encourage routine use of nanoscopic structural probes within the compound semiconductor industry. To address this Air Force need for efficient nanostructural and atomic level compositionial analysis of microelectronic and optoelectronic devices, Physical Optics Corporation (POC) proposes to develop a new Scanning X-ray Diffraction Microscopy (ScanXM) system. This proposed ScanXM is based on a combination of coherent diffractive imaging (CDI) and scanning transmission X-ray microscopy (STXM). The innovation in using a combination of the two X-ray imaging and image processing techniques will allow ScanXM to achieve a high spatial resolution of 10-20 nm. As a result, this technology offers a novel imaging tool for nanoscale structures analysis. In Phase I, POC will demonstrate the feasibility of ScanXM by assembling all fabricating components in a single system and evaluating its spatial resolution and analytical capabilities. In Phase II, POC plans to develop a pre-production prototype ScanXM and demonstrate that it can be utilized in compound semiconductor device imaging applications. BENEFIT: Military applications of the ScanXM will include using it as an analytical tool for the AFRL/SN compound semiconductor research. In addition, commercial applications of the ScanXM will include development of a novel microscopy technique, which will be used in the semiconductor manufacturing industry, microbiology, and nanotechnology research.