Innovative Active Array Radar Sensor

Aguila Technologies, together with Sensis Corporation, proposes innovative and practical solutions for the assembly and thermal management of active phased array Transmit/Receive modules employing high power density wide bandgap electronic devices. Our approach involves mounting the wide bandgap die using advanced thermal bonding materials onto thermally-enhanced metal matrix composite packages to thereby efficiently extract heat from the devices, spread the heat by a combination of unique materials, and dissipate the heat to the system's cooling media via novel structures. Our approach builds upon already demonstrated materials, structures, and processes to provide packaging designs which are manufacturable and cost effective. The applications extend far beyond wide bandgap RF and power conversion electronics, to optoelectronics, high power processors, etc. It is fully compatible with system level design and implementation issues. In summary, our offering is an enabler for inserting new electronic device technologies into next-generation DoD and commercial systems.