Advance Thermal Management of Large Multiband Phased Arrays

The main issue preventing widespread use of x-band antennae systems in military platforms is cost. Cheaper assembly processes, e.g. automated pick and place and larger formats are needed to implement wideband gap semiconductor devices (GaN and SiC). Lessons learned in GaAs based systems are difficult to transition to WBG based systems because of the widely different materials required for CTE 7 ppm/K (GaAs) and CTE 4-5 ppm/K (WBG) semiconductors. Higher power/frequency is thermally challenging. Lightweight heat sinks that are CTE matched to GaN/SiC or to advanced GaAs devices, highly conductive, available in ~half meter square sizes and inexpensive are required. Of all of the candidate, only the MetGraf family can be designed and scaled to large formats required by prime partners. Technical issues for MetGraf, including corrosion resistance, plating, soldering adaptability, and mechanical strength were successfully addressed in Phase I and those investigations will continue into Phase II. This program enables MMCC to develop MetGraf technology to support our partner’s multi band phased array projects and large format thermal core projects. The emphasis of Phase II is on evaluating large format base plates and thermal cores and upgrading production capacity to enable significant manufacturing and process cost reduction.