High Temperture, High Power Density Electronic Devices

MER and RSC are developing advanced high temperature electronic packaging for power electronics based on SiC devices which can operate at junction temperatures above 300°C and baseplate temperatures of above 200°C. The packaging is being utilized in a hybrid SiC/Si 3-phase inverter for high power motor drives with output of 15kW. The inverter modules developed in Phase II will contain Si based IGBTs and SiC based Schottky diodes to reduce reverse recovery losses on switching. These motor drives developed in the Phase II program will be of higher reliability and efficiency than present motor drives with reduced requirement for forced air cooling. These inverter modules will be used in a modular design to produce a 50kW and up to a 138kW motor drive for NAVY applications. In the Phase II option, the packaging will undergo only minor modifications to be insertion ready for all SiC components. In the Phase II option the modular inverter design will be cooled by natural convection alone.