Multiresolution Thermal Design/Signature Management Tool for Vehicle Electronics Packages

We propose to develop a multi-resolution software tool for thermal design and management of heat generated in vehicles by multiple electronics packages in close proximity. The software will interface with industry-standard thermal-signature code, MuSES (in collaboration with ThermoAnalytics) for efficient multi-functional capability. An innovative selective focusing feature will allow representation of system components at different resolutions, from fully 3D for use with CFD thermal flow solvers, to 0D reduced models based on fast, accurate artificial-neural-networks (ANNs). The feasibility of this approach has been demonstrated in Phase 1 of this research. In Phase 2 we will refine the developed tools and add software functionalities to streamline system set-up and analysis. In particular we will: 1) Complete development of a multi-level graphical user-interface (GUI) for rapid system specification/definition, with screen-based drag-and-drop approach to assemble reduced models, couple models to complex vehicle geometries imported from CAD packages, and interface with MuSES. 2) Develop automated script-driven procedures for development of ANN-based reduced-order models of electronics packages. 3) Develop a library of reduced models of components and subsystems for integration with the GUI. The complete software suite will be validated and demonstrated on selected vehicle configurations in consultation with TACOM.