Complex Electronics Packaging Thermal/Signature Management Design Tool

One of the main sources of inaccuracy in the thermal analysis of an electronics system is the application of the “correct” boundary conditions in order to link the system to its surroundings. This is due to the fact that electronic systems are occasionally grouped in close quarters in such a way that the temperature field in each system is strongly influenced by the operating temperature of the others. There is a need for a tool that can be used to determine the consequences. With recent advances in computer hardware and software technologies, it is now possible to develop this next generation software package. MuSES, a firmly established heat and signature management program, is the ideal parent program for this tool due to its simplicity, ability to model complex systems and the fact it is already being used successfully by the DOD and other commercial entities. As the developer and marketer of ElectroFlo® (EFlo), a state-of-the-art thermal analysis package for electronic systems, TES has access to the resources and know-how associated with one of industries most full-featured and easy-to-use electronics thermal management tools. This experience will be a priceless asset for the development of this “next generation” tool.