Complex Electronics Packaging Thermal/Signature Management Design Tool

The overall objective of the proposal is to develop a software package for thermal/signature analysis of electronic systems that can be used during rapid prototyping exercises to study the thermal behavior of complex electronic packages, both individually and as a complete system with multiple packages in close proximity. The tool must be able to accurately predict the thermal field in each package, taking into account the consequences of other electronic boxes in its environment, and easily and seamlessly be integrated into a "parent" MUSES model for global system prediction. With recent advances in computer hardware and software technologies, it is now possible to develop a "next generation" software package for the thermal management of complex electronic systems - one that is capable of simulating several models of various electronic systems at once, all integrated into a global model that is running in parallel.