Low-Cost Day/Night Imaging Sensors for Micro/Mini-Uninhabited Aerial Vehicles (UAVs)

During this Phase I program CSC will produce a hardware demonstration of its InGaAs Short Wavelength Infrared (SWIR) sensor processor coupled to Raytheon’s Low Cost Miniature Data Link (LCMDL) unit serving as a state-of-the-art digital downlink. The prototype camera system will be used to guide further integration and weight/power reduction in a transition to CSC’s Alternate Architecture (AA) technology in Phase II. The AA dramatically improves ‘on-FPA’ processing capability by allowing complex spatial and temporal filtering to be performed prior to digitization in addition to performing typical detector ROIC roles of signal integration and muxing operations. One or more layers married to a detector array using conventional bump-bonding is a highly functional integrated sensor processor (ISP) well suited for the dynamic range management and scene-based NUC processing needed on UAV platforms. The result of this effort will be a hardware validated camera/image processing/digital data downlink system design that includes all requisite electronics, optics and a state-of-the-art digital down linking compatibility that will exceed the goals of the solicitation. In addition, a feasibility study/program plan for integrating micro-bolometer thermal imaging with the AA will be developed as an optional technical direction for government selection in Phase II.