SBIR/STTR Research Award

Biodegradable Printable Insulating Dielectric for Multilayer Rigid and Flex Printed Circuit Board (PCB) Board Manufacturing

Award identifier 6db87ebe5843f947a65a1d965fe07864447cc4ab9d3c01811ffe106b3853561bAwarding agency Department of Commerce · National Institute of Standards and Technology

Award amount

$99,865

Program and phase

SBIR · Phase I

Award year

2025

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Award details

Awarding agency
Department of Commerce
Branch
National Institute of Standards and Technology
Recipient company
CHEM3 LLC
Proposal award date
2025-08-01
Contract end date
2026-01-31
UEI
H9P2QGRGMMY6
Solicitation number
2025-NIST-SBIR-01
Topic code
6

Research abstract

here exists a need for insulating printable dielectric to also be biodegradable to make the PCB be truly sustainable. There has been much research work done in recent years for printable Biodegradable Cellulose materials has been used for 3D applications using standard 3D printing methods from extrusion to photopolymerization . There has been work done in cellulose as a filler in a 3D printing of sensors, but there is not a commercially viable method yet for sustainable printed electronics. Developing a Biodegradable printable material that can meet the mechanical and electrical requirements of most sectors within the electronics industry would be a game changer.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

6 SBIR/STTR records share this UEI (2021–2025). Reported award amounts total $899,402. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Commerce, Department of Defense, National Aeronautics and Space Administration

Agency intelligence

Department of Commerce

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