SBIR/STTR Research Award

On Demand Printing ofStretchable Electronics

Award identifier d8f281986255dbcd2a33681ae7b79fd65eefd39d4614b62911d64856561fed09Awarding agency National Aeronautics and Space Administration

Award amount

$149,978

Program and phase

SBIR · Phase I

Award year

2022

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
CHEM3 LLC
Proposal award date
2022-07-20
Contract end date
2023-01-25
UEI
H9P2QGRGMMY6
Solicitation number
SBIR_22_P1
Topic code
Z8

Research abstract

Printing electronicsnbsp;is a new and quickly growing alternative to traditionally manufactured electronics wherein an additive method is used to produce electronic circuits, passive circuitry, displays, sensors, utilizing conductive and sometimes dielectric materials. Advances have been made in electronic printing technology in recent years bringing it closer to scalable manufacturing. Flexible PCBs (FPCB) provide the same processing capability as a standard PCB, with added flexibility, and are better suited for space applications. FPCBrsquo;s are more reliable, can bend without breaking / sustaining damage, can withstand greater stress and harsher conditions, and can be adapted to smaller spaces due to thin copper and insulating layers.nbsp;ChemCubed (C3) provides additively manufactured (AM) printing solutions for electronics. One of the key advances in recent years in AM electronics has been in the conductive inks for inkjet printing. This advance is a main reason why scalable printed manufacture PCBs is now within reach. C3 leads the way in particle-free reactive silver inks, providing the highest conductive performance, sintering efficiency and printing reliability available in the market. C3 has developed the best conducting ink available, and a system of products to use inkjet technology to print F/PCBs.nbsp;A nanocomposite dielectric material is needed to serve as (a) insulating layers between the circuits, (b) masking material for soldering, and (c) support at connection points. This material will be develioed to have the following properties: a) high tear and strain resistance, b) compatible with silver ink, c) dielectric constant between 3 to 4, d) good printing performance through a prize inket head, and e) electrical insulating properties.nbsp;This work is in the development stages already, and will be fully addressed in the proposed project phases I amp; II. The goal for this Phase I is to develop and produce an ink-jettable metal ink.nbsp;nbsp;

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

6 SBIR/STTR records share this UEI (2021–2025). Reported award amounts total $899,402. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Commerce, Department of Defense, National Aeronautics and Space Administration

Agency intelligence

National Aeronautics and Space Administration

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